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Applied Materials (NASDAQ:AMAT) stock is ripping again. Shares are up 11% today to $697.61 in Monday trading, marking a fresh high, after KeyBanc Capital Markets issued a bullish early note ahead of the company’s Q3 FY2026 earnings report. The pop extends an already historic run. Applied Materials stock is up 55.61% over the past month, ... Applied Materials Just Ripped 55% in a Month. Is It Time to Sell?
Applied Materials stock surged to a record high after getting two price-target hikes. AMAT stock has been on a tear this year.
Applied Materials shares are trading higher by over 11% Monday as analysts lift targets, and chip stocks rally with the Nasdaq-100 up 2.4%.
KeyBanc is optimistic about the likelihood of positive outcomes, but also noted that any actual or perceived disappointment in results could trigger downside volatility.
Applied Materials benefits from a robust semiconductor equipment market, driven by strong AI/data center demand. Find out why AMAT stock is a sell.
Cantor Fitzgerald analyst C.J. Muse maintains Applied Materials (NASDAQ:AMAT) with a Overweight and raises the price target from $650 to $850.
Jefferies analyst Blayne Curtis maintains Applied Materials (NASDAQ:AMAT) with a Buy and raises the price target from $510 to $770.
B. Riley Securities analyst Craig Ellis maintains Applied Materials (NASDAQ:AMAT) with a Buy and raises the price target from $550 to $790.
Wells Fargo analyst Joe Quatrochi maintains Applied Materials (NASDAQ:AMAT) with a Overweight and raises the price target from $715 to $740.
Applied Materials' cash flow falls after strategic capacity and supply chain investments as AI-driven chip demand supports growth through 2027 and beyond.
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation
Why investing for the long run, especially if you buy certain popular stocks, could reap huge rewards.
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logicNew eBeam systems bring wafer-fab-grade metrology and defect review t